Category Archives: All

February 22, 2008L EuP power supplies

The fourth meeting of the EuP Consultation forum is held to consider Implementing Measures for external power supplies simple set top boxes. Power efficiency standards for no-load and load conditions will become mandatory under the “CE” mark to place products on the EU market.

January 1, 2008: Update on Korea RoHS

Korea RoHS was to have come into effect on Jan 1, 2008. Enforcement has been formally delayed until July 1, 2008 due to the late signing of supporting legislation (Presidential Decree and Enforcement Regulation).  Note: Korea RoHS has significant additional provisions compared to EU RoHS and China RoHS. However, all three regulations restricted the same six substances.

December 15, 2007: Draft standard for analytical testing of RoHS substances

The draft standard IEC 62321 on Procedures for the determination of levels of six regulated substances (Lead, Mercury, Cadmium, Hexavalent Chromium, Polybrominated Biphenyls, Polybrominated Diphenyl Ethers) was approved by the IEC/TC111 committee. Both industry and government have been awaiting the publication of this standard to provide a common agreement for testing for the RoHS

November 2, 2007: NWML releases report on UK RoHS Enforcement.

The UK RoHS enforcement authority, the National Weights and Measures Laboratory (NWML), has released its first year report on enforcement of the EU RoHS Directive. The NWML confirmed that a large number of compliance issues had been found and remedial actions taken with several producers. Enforcement was hampered by limitations defined in the UK RoHS regulation; the regulation will be updated in Feb 2008 to increase enforcement powers.

May 29, 2007: Intel goes Pb-free in processors

Intel announces that their next generation processors will be entirely Pb-free. Intel has been hinting for the past year that it will move to discontinue it’s Pb-based manufacturing. The next generation processors will be available only with Pb-free terminations/balls and will not require the Pb in flip-chip exemption that has been used throughout the semiconductor manufacturing industry. Intel also plans to discontinue its existing Pb-based products, but has not set a specific date.

April 2007: International standard on Environmentally Conscious Design (ECD)

The IEC is developing an international standard on Environmentally Conscious Design (ECD) of IT and Communication Technology products (IEC62075, Ed 1.0). The standard is being developed by experts within the TC108 committee — representatives from the major IT and communication equipment producers. Balloting on the draft standard closed this month. The current proposal specifies requirements and recommendations for the environmentally conscious design of products with regard to:

  • life cycle thinking aspects,
  • material efficiency,
  • energy efficiency,
  • consumables and batteries,
  • chemical and noise emissions,
  • extension of product lifetime,
  • end of life,
  • hazardous substances/preparations,
  • product packaging, and
  • documentation.

October 14, 2006: RoHS exemptions

The European Commission has officially published the nine exemptions approved by the TAC (Technical Adaptation Committee) in June 2006. The exemptions were published in Commission Decisions 2006/690/EC, 2006/691/EC, and 2006/692/EC. The new exemptions include hexavalent chromium in select category 3 applications and Pb in the terminal finish of select fine pitch Integrated Circuits.